Ron Maltiel       Semiconductor Consulting
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Semiconductor Consulting Services, Expert Witness, and Patent Litigation Support


"Ron is accessible, fast and accurate. He knows to ask the right questions and does a thorough, 
top-notch job. I would not hesitate to use Ron's services again."

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Semiconductor Circuit News

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  • Semiconductor Mergers, Acquisitions in 2015 and 2016
  • Interconnect Issues: History and Future Prospects​
  • Transistor Channel Future
  • First Time Smartphones Outsold Feature Phones
  • Tablets, Smartphones, and SSDs Share of NAND Market in 2013
  • Top Semiconductor Ranking 2012 (Sales, Growth)
  • Tablets are the New Mobile 
  • Apple A7 Foundry:TSMC, Samsung, Intel?
  • Samsung Galaxy S4 BOM $236 (Manufacturing Cost)
  • Apple's Next iPad and iPhone A Microprocessor
  • ISSCC 2013 Memory Trends: Flash, NAND, and DRAM
  • ISSCC 2013 Digital Trends in High Performance
  • ISSCC 2013: Wireless Evolution
  • IC Moore's Law Running out of Money
  • Integrating Flash in DDR4 DIMMs 
  • Radically Extending Cycling Endurance of Flash Memory Past 100M  Cycles 
  • Hynix 30 nm DRAM layout, process integration
  • Top 2012 IC Foundries (Pure-playand  IDM)
  •  TSMC 28nm Process Reverse Engineering Results 
  • ISSCC 2013 Preview 
  • 2013 International Solid-State Circuits Conference  (ISSCC) 
  • Apple iPad 4 – A6X Tear-down 
  • 3D Flash NAND Devices and Process 
  • Samsung Unveils 10 nanometre(nm)-class (10 - 19nm) Embedded  Memory Card
  • Qualcomm, Globalfoundries +30% in Sales in 2012
  • FinFET Layout Design and Variability 
  • IEDM 2012 Preview: 20nm and Smaller 
  • IEDM 2012 Program 
  • Intel's 14nm Process and Manufacturing Roadmap 
  • Apple's A6X Processor 32nm Process  Advantages 
  • Latest Microsoft Surface TearDown _
  • Toshiba Next NAND- 3D with 15 Layers 
  • Next iPhone A7 Made by TSMC not Samsung   
  • Japan Fading in Semiconductor Fabrication? 
  • Android vs iPad Sales 48% to 52%
  • Semiconductor Foundries: Strong Q2, but  Slowdown.. 
  • Lenovo Prove: Outsourcing is Not the Only Way  (Updated) 
  • DRAM Market Plateau/ Flash NAND Growing
  • Apple Cutting Out Samsung Chips? 
  • iPhone A6 Teardown Update

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  • NAND:Prices, Market Shares (Micron Up, Toshiba Down..)
  • iPhone A6 Performance Improvement
  • iPhone Teardown Updated
  • iPhone 5 Cost $199 BOM
  • SSD, Flash, iPad, PC, Tablet, and Servers Architecture
  • Google, Facebook Top Buyers of Intel Server Chips
  • Apple Cuts Samsung Orders: Lawsuits Impact?
  • iPad, iPhone and Tablets => Flash, DRAM Markets Crosscurrents
  • IBM Ecosystem: $1 billion Drives 40% Profit
  • Apple Seeks Injunction Against Old Samsung Phones
  • Apple vs. Samsung: Not Really an Apple Win
  • Flash Memory Sales Surpass DRAM
  • Samsung, a Top IC Foundry in 2012
  • IBM Acquires Texas Memory (SSD Vendor)
  • Smartphone Patent Wars Solutions
  • Intel: Tremendous Growth of Clouds' Servers
  • Semiconductor Ranking: Foundries Soar, Japanese Crash
  • Samsung, Hynix, Micron DRAM Monopoly?

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  • Apple vs.Samsung Case: Can Design Patents Win
  • Apple Slipping Smartphone Market Share (Samsung Patent Litigation?)
  • Apple iPhone 2x Profit vs.iPad
  • TSMC: Single-Customer (Apple? Qualcomm?) Fabs Make Sense
  • ARM, TSMC Following Intel Lead
  • Smartphone Dark Horse: Huawei
  • Qualcom, Intel, Samsung, TSMC and foundary Business
  • Flash NOR Memory Revival
  • Top Patent Recipients (33% Semiconductor Companies)
  • 450-mm-fabs-ramp-in-2017
  • NAND Flash +DRAM Improves Memory Sys
  • Intel, ASML: Higher Performance/ Lower Cost Edge
  • Nexus 7 Tablet Teardown: +4% Mem. Cost Add $50 Profit

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  • Lenovo Prove: Outsourcing is Not the Only Way
  • iPhone: Quad-Core Processor
  • Samsung, Qualcomm: New Foundry Business Model
  • Microsoft: Million+ PC, Laptop, DRAM failures
  • Status of China's Fabless Model
  • Flash Memory Controller is the Secret Sauce
  • Cache SSD Shipments to Explode
  • Hynix Developing PCM, MRAM, and ReRAM Flash
  • Apple's iPad, iCloud Drive Semiconductor Industry
  • 2012 Q1 Ranking: Toshiba Outperforms NAND Market
  • Cloud Storage, Servers Drive IC Demand
  • Intel, Google and Smartphones
  • Apple Television; Interface, Design, App...
  • Apple NAND Storage in Upcoming MacBook Pros
  • Flash, DRAM Memory Impact Smartphone Design
  • Intel Roadmap to 2015 and Beyond: 5nm Technology
  • Hynix Next Gen. NAND Flash
  • Intel: Installed Base Adv. for Tablets, Wibdow8 vs. Arm processor
  • Smartphone Components Cost; NAND Flash, Display, DRAM
  • Nvidia #1 at TSMC Fab? Nvida has Priority for 28nm capacity
  • Simon Sze Inventor Floating Gate Non VolatileM Memory (NVM)
  • First DDR4 DRAM from Micron
  • Apple's A5 Die Shrink, Improve Battery Life, Cut Cost
  • Micron Technology Likely Winner, Buying Chipmaker 

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  • TSMC To Makes Processer Chip For Apple? Not so Quickly
  • Q4'11 NAND Flash Ranking, Can We Trust the Numbers?
  • US Fabs Losing Their Edge. Really?
  • Intel: "Fabless model collapsing". Is it correct?
  • Qualcomm and Nvidia Chip Shortage
  • Intel, AMD, or ARM Holdings Servers?
  • Top 25 2011 Semiconductor Sales Ranking
  • TSMC 28nm Capacity Large Shortage
  • Flash is not just about storage
  • Six Technologies that Save Smartphone Batteries
  • Real Growth Paths for Flash Memory
  • New Foundry Ranking (By IC Insights)
  • Intel/ Micron 20-nm 64G MLC NAND Flash Memory Reverse Engineered
  • Foundry Rankings (Including Samsungs' iPad, iPhone Breakdown)
  • While FinFET Charging Ahead, Other 20nm challenges
  • Qualcomm, Intel Fastest Growing Semiconductor Companies
  • Nvidia: TSMC 20nm Essentially Worthless
  • Moore's Law Slowwwing Since 28nm Process Node
  • New iPad-Teardown: Why Apple's A5X uses 45nm
  • Are Japan's Fabs stuck above 28nm Process Technology?
  • Is Samsung Cutting Qualcomm's Cord?
  • iPad Teardown - Flash NAND Memory is a Major Profit Source
  • Moore's Law End? (Next semiconductors generation cost $10 billion)
  • When will the Flash be 2x DRAM Memory Market?

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  • Is Resistive RAM (RRAM) The Future Flash Memory?
  • Flash to 'Checkmate' Hard Drives by 2020, Next DRAM
  • Samsung develops faster DRAM Chips for Next-gen Mobile Devices
  • Storage Performance Affect Smartphone Performance
  • Non Volatile Flash Memory Basic
  • 2011 IEDM Full Technical Program, Previews
  • Semiconductor Plant Rebooted Three Months Faster After The Japanese Earthquake
  • Flash Summit 2011: New Insights Into the Future of NAND Flash, Top 10 Lists Trends
  • Flash Memory Summit 2011: Fusion-io, STEC, and Other Presentations
  • Intel 22nm 3D Tri-Gate FinFETs Transistors: Faster, Cooler, Smaller
  • Semiconductor News: Japan Earthquake Impact Electronic Supply Chain
  • ISSCC 2011 Highlights- 20-nm Process Challenges, Samsung 512-pins DRAM, Intel SandyBridge, AMD Bulldozer
  • Samsung develops superfast mobile DRAM
  • NAND Flash Evolution 2006 to 2010
  • Semiconductor News: TI, Qualcomm, Samsung Tablet processors
  • Future technologies that may succeed flash memory
  • Upcoming 2011 International Solid State Circuits Conference (ISSCC)
  • 2010 International Technology Roadmap for Semiconductors (ITRS) Updates
  • 2010 IEDM Update
  • iPhone/ Android Smart Phone Repeating Mac/ PC Market Patterns?
  • 2010 IEDM Full Technical Program, Previews

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  • Semiconductor IC Ranking 2009 (Samsung, Hynix growing, SanDisk surprise)
  • Integrating High-k Metal Gate: First or Last
  • ISSCC 2010 - Intel, Renesas, Toshiba show mobile media chips, Inductive coupling packs flash drive, Chip links hit 20 Gbits/s, power lows
  • Four Billion Cell Users : Computing Power Anytime, Anyplace
  • Google Nexus One Carries $174.15 Materials Cost, iSuppli Teardown Reveals
  • IEDM 2009 -Will IBM Shift to Gate-Last; Intel 32 nm PMOS; Silicon CMOS for 22 nm; Logic Processes
  • How much of a lead does Intel have at 32nm and for High-K Metal Gate (HKMG) Technologies?
  • Semiconductor Industry Trends in Light of 2008 Economic Upheaval
  • Semiconductor IC Ranking Q3 2009 (fast growth at Samsung, Toshiba, Hynix, Micron)
  • Intel Developer Forum 2009: Performance, Reliability, and Future Direction of Solid State Drive (SSD)
  • Flash Memory Summit 2009: Fusion-io, STEC, Denali and Other Presentations
  • Semiconductor Inventory and its Impact on Electronic Supply Chains- iSupply
  • Semiconductor IC Ranking Q2 2009(Climbing TSMC, Hynix, MediaTek Droping AMD, Freescale, Fujitsu)
  • Intel’s New SSD X25 Reviews and Benchmarks

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  • Apple iPhone 3GS Teardown (Reverse Engineering) of Chip Components and Software Capabilities
  • SSD Market Share and Sales with Breakdown by Density
  • Palm Pre Teardown
  • Q&A: Analogic CEO
  • Semiconductor Companies Q1 2009 Market Shares
  • DRAM and NAND Q1 2009 Market Shares
  • Is Mobile Computing the Next Big Market?
  • SandForce Brings MLC to Solid State Drives (SSD)
  • Long Term Trends in the NOR and NAND Markets
  • Fusion-io Super Fast NAND Flash Storage Using PCIe for Enterprise Market
  • Faster Cheaper Solid-State Hard Drive
  • ISSCC 2009
  • ISSCC 2009 Preview
  • 15 Technology Challenges for 22-nm Node
  • DRAM Ranking for Second and Third Quarters

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  • China's Semiconductor Industry
  • Semiconductor Industry Rankings for First Three Quarters of 2008
  • SanDisk's ExtremeFFS - New Flash Management System for Improving SSD Performance and Reliability
  • Samsung Buying Sandisk? (Update)
  • Samsung Buying Sandisk?
  • Status of Semiconductor's Intellectual-Property (IP)
  • Fab Cost is Increasing The Number of Joint Ventures and Joint Developments
  • Learning Curve Leads to Shakeout in SSD Market
  • NAND for mobile handsets: cost, density and performance advantages
  • 2008 Semiconductor Industry Rankings - IC Insights
  • Intel Developments- Mobile Phone and TV Processor
  • Netbook (or Low Cost) PC Market
  • Intel's SSD Drives
  • Samsung Electronics and Sun Microsystems Increased 5x Endurance of Solid State Drives (SSD) with 8 Gbit Single-Level-Cell (SLC)


Additional Semiconductor News

  • Non-Volatile Memory Host Controller Interface (NVMHCI)
  • Demand for NAND Flash Memory for Handsets Doubles its Share of Market, Making up the Biggest Share of NAND Market
  • Update - Apple’s iPhone 3G Semiconductor Parts
  • Solid-State-Based Lighting Could Cut the Energy Used by Lighting in Half, Says the U.S. Department of Energy (DOE)
  • Leave Laptop at Home and Travel with USB Key Drive Instead
  • VLSI 2008 Symposium Highlights
  • VLSI 2008 Circuits Program
  • Trends in the Wi-Fi industry - Michael Hurlson of Broadcom
  • Trends in storage, the economy and network - LSI CEO Abhi Talwalkar
  • Seagate Technology, the World's Largest Maker of Hard Disk Drives (HDDs) Sues STEC, a Small Solid-State Drives (SSD) Maker
  • Faster SSD Appearing in the Market (estimate 200MB/sec)
  • iPod Touch Components likely to be in Future of the iPod line - iSuppli Tear Down
  • Evolution of Components in Smart Phones
  • Taiwan IC Designers Venture into New LED Applications
  • Flash Memory and SSD Reliability - Comments by Intel and Samsung
  • MTRON 32GB SSD vs. Seagate and Samsung 's SSD
  • 2008 Semiconductor Industry Growth and 2007 Rankings and Revenues - iSuppli
  • ISSCC 2008 Highlights
  • Intel, Micron New ONFi 2.0 Interface Boost the Data Transfer Rate of NAND Flash-Memory 5x
  • Reverse Engineering of iPhone Video
  • Comparing iPhone, Blackberry, Sony Ericsson, and Motorola
  • Counterfeit Part's Impacts on the Semiconductor Industry
  • Memory Chip Architecture Development - Harnessing Multiple Cores for Parallel Execution
  • IC Semiconductor's 2008 Growth Forecasts for PCs, Memories, and Phones from Industry Strategy Symposium (ISS)
  • Chip Makers Must Shift from Fabs to Systems - Infineon CEO
  • Samsung, Toshiba Share OneNAND and LBA-NAND Flash Specs to Improve Supply Availability
  • Intel and STMicroelectronics Shipping Functional Prototype of Phase-Change Memory (PCM)
  • Rambus Demonstrates Terabyte Memories Using Fast Channels
  • IEDM Technical Program - 2007
  • A Very Low-Power Analog-to-Digital (A/D) Converter Technology
  • LED Developments for Alternating Current (AC) LEDs in LCD Backlights and for Lighting Traffic Lights,  and Emergency Exit Signs.
  • Toshiba's Logical Block Addressing (LBA) Interface for NAND Flash Reportedly has Received Support from Samsung Against ONFI
  • iPhone Semiconductor Components
  • Comments About the Push to Reduce the Specifications for ESD in Digital ICs
  • NVMHCI Standard for NAND Flash Module Controllers in Notebooks, Desktops, and Servers
  • PC's Crashes Due to Single-bit DRAM Errors and Can be Solved Using ECC- According to Microsoft
  • DDR3 New Product Validation, Shipments by Qimonda, Micron, Samsung, and Elpida
  • Key Developments in Intel's Quad-core, Penryn, Silverthorne & Mobile Processors
  • Leading Chip Makers Push to Reduce the Specifications for ESD in Digital ICs
  • Mosaid Claims New Flash Interface Offers 10x Boost
  • Hynix Received Validation on its DDR3 Memory Components and Modules from Intel
  • Qimonda and Micron Technology Delivered Samples of Next-Generation DDR3 DRAM Ahead of Samsung Electronics
  •  PCM and FRAM Products Introduction
  • Hynix Introduces 512Mb Mobile DDR with ECC Support
  • U.S. Consumer  Electronic Spending Slowed in 2006 to Half the Growth Rate in 2005
  • ISSCC News  - Substantially Faster DRAM using SOI for Embedded Applications
  • Renesas and Matsushita Develop Circuits to Stabilize SRAM Operation in Embedded Control Applications on 45nm Technology
  • SanDisk Introduces 32GB SSD 1.8-inch Solid State Drive (SSD) as a Drop-in Replacement for the Standard Mechanical Hard Disk Drive
  • Open NAND Flash Interface (ONFI) Group Introduced a Chip-level Interface Standard for NAND Flash Memory
  • Automotive Electronics Future Trends for Micro, Memory, Logic ICs; Analog, Mixed Signal and Discrete Devices 
 

copyright 2013 Ron Maltiel all rights reserved