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Semiconductor Circuit News
- Semiconductor Mergers, Acquisitions in 2015 and 2016
- Interconnect Issues: History and Future Prospects
- Transistor Channel Future
- First Time Smartphones Outsold Feature Phones
- Tablets, Smartphones, and SSDs Share of NAND Market in 2013
- Top Semiconductor Ranking 2012 (Sales, Growth)
- Tablets are the New Mobile
- Apple A7 Foundry:TSMC, Samsung, Intel?
- Samsung Galaxy S4 BOM $236 (Manufacturing Cost)
- Apple's Next iPad and iPhone A Microprocessor
- ISSCC 2013 Memory Trends: Flash, NAND, and DRAM
- ISSCC 2013 Digital Trends in High Performance
- ISSCC 2013: Wireless Evolution
- IC Moore's Law Running out of Money
- Integrating Flash in DDR4 DIMMs
- Radically Extending Cycling Endurance of Flash Memory Past 100M Cycles
- Hynix 30 nm DRAM layout, process integration
- Top 2012 IC Foundries (Pure-playand IDM)
- TSMC 28nm Process Reverse Engineering Results
- ISSCC 2013 Preview
- 2013 International Solid-State Circuits Conference (ISSCC)
- Apple iPad 4 – A6X Tear-down
- 3D Flash NAND Devices and Process
- Samsung Unveils 10 nanometre(nm)-class (10 - 19nm) Embedded Memory Card
- Qualcomm, Globalfoundries +30% in Sales in 2012
- FinFET Layout Design and Variability
- IEDM 2012 Preview: 20nm and Smaller
- IEDM 2012 Program
- Intel's 14nm Process and Manufacturing Roadmap
- Apple's A6X Processor 32nm Process Advantages
- Latest Microsoft Surface TearDown _
- Toshiba Next NAND- 3D with 15 Layers
- Next iPhone A7 Made by TSMC not Samsung
- Japan Fading in Semiconductor Fabrication?
- Android vs iPad Sales 48% to 52%
- Semiconductor Foundries: Strong Q2, but Slowdown..
- Lenovo Prove: Outsourcing is Not the Only Way (Updated)
- DRAM Market Plateau/ Flash NAND Growing
- Apple Cutting Out Samsung Chips?
- iPhone A6 Teardown Update
- NAND:Prices, Market Shares (Micron Up, Toshiba Down..)
- iPhone A6 Performance Improvement
- iPhone Teardown Updated
- iPhone 5 Cost $199 BOM
- SSD, Flash, iPad, PC, Tablet, and Servers Architecture
- Google, Facebook Top Buyers of Intel Server Chips
- Apple Cuts Samsung Orders: Lawsuits Impact?
- iPad, iPhone and Tablets => Flash, DRAM Markets Crosscurrents
- IBM Ecosystem: $1 billion Drives 40% Profit
- Apple Seeks Injunction Against Old Samsung Phones
- Apple vs. Samsung: Not Really an Apple Win
- Flash Memory Sales Surpass DRAM
- Samsung, a Top IC Foundry in 2012
- IBM Acquires Texas Memory (SSD Vendor)
- Smartphone Patent Wars Solutions
- Intel: Tremendous Growth of Clouds' Servers
- Semiconductor Ranking: Foundries Soar, Japanese Crash
- Samsung, Hynix, Micron DRAM Monopoly?
- Apple vs.Samsung Case: Can Design Patents Win
- Apple Slipping Smartphone Market Share (Samsung Patent Litigation?)
- Apple iPhone 2x Profit vs.iPad
- TSMC: Single-Customer (Apple? Qualcomm?) Fabs Make Sense
- ARM, TSMC Following Intel Lead
- Smartphone Dark Horse: Huawei
- Qualcom, Intel, Samsung, TSMC and foundary Business
- Flash NOR Memory Revival
- Top Patent Recipients (33% Semiconductor Companies)
- 450-mm-fabs-ramp-in-2017
- NAND Flash +DRAM Improves Memory Sys
- Intel, ASML: Higher Performance/ Lower Cost Edge
- Nexus 7 Tablet Teardown: +4% Mem. Cost Add $50 Profit
- Lenovo Prove: Outsourcing is Not the Only Way
- iPhone: Quad-Core Processor
- Samsung, Qualcomm: New Foundry Business Model
- Microsoft: Million+ PC, Laptop, DRAM failures
- Status of China's Fabless Model
- Flash Memory Controller is the Secret Sauce
- Cache SSD Shipments to Explode
- Hynix Developing PCM, MRAM, and ReRAM Flash
- Apple's iPad, iCloud Drive Semiconductor Industry
- 2012 Q1 Ranking: Toshiba Outperforms NAND Market
- Cloud Storage, Servers Drive IC Demand
- Intel, Google and Smartphones
- Apple Television; Interface, Design, App...
- Apple NAND Storage in Upcoming MacBook Pros
- Flash, DRAM Memory Impact Smartphone Design
- Intel Roadmap to 2015 and Beyond: 5nm Technology
- Hynix Next Gen. NAND Flash
- Intel: Installed Base Adv. for Tablets, Wibdow8 vs. Arm processor
- Smartphone Components Cost; NAND Flash, Display, DRAM
- Nvidia #1 at TSMC Fab? Nvida has Priority for 28nm capacity
- Simon Sze Inventor Floating Gate Non VolatileM Memory (NVM)
- First DDR4 DRAM from Micron
- Apple's A5 Die Shrink, Improve Battery Life, Cut Cost
- Micron Technology Likely Winner, Buying Chipmaker
- TSMC To Makes Processer Chip For Apple? Not so Quickly
- Q4'11 NAND Flash Ranking, Can We Trust the Numbers?
- US Fabs Losing Their Edge. Really?
- Intel: "Fabless model collapsing". Is it correct?
- Qualcomm and Nvidia Chip Shortage
- Intel, AMD, or ARM Holdings Servers?
- Top 25 2011 Semiconductor Sales Ranking
- TSMC 28nm Capacity Large Shortage
- Flash is not just about storage
- Six Technologies that Save Smartphone Batteries
- Real Growth Paths for Flash Memory
- New Foundry Ranking (By IC Insights)
- Intel/ Micron 20-nm 64G MLC NAND Flash Memory Reverse Engineered
- Foundry Rankings (Including Samsungs' iPad, iPhone Breakdown)
- While FinFET Charging Ahead, Other 20nm challenges
- Qualcomm, Intel Fastest Growing Semiconductor Companies
- Nvidia: TSMC 20nm Essentially Worthless
- Moore's Law Slowwwing Since 28nm Process Node
- New iPad-Teardown: Why Apple's A5X uses 45nm
- Are Japan's Fabs stuck above 28nm Process Technology?
- Is Samsung Cutting Qualcomm's Cord?
- iPad Teardown - Flash NAND Memory is a Major Profit Source
- Moore's Law End? (Next semiconductors generation cost $10 billion)
- When will the Flash be 2x DRAM Memory Market?
- Is Resistive RAM (RRAM) The Future Flash Memory?
- Flash to 'Checkmate' Hard Drives by 2020, Next DRAM
- Samsung develops faster DRAM Chips for Next-gen Mobile Devices
- Storage Performance Affect Smartphone Performance
- Non Volatile Flash Memory Basic
- 2011 IEDM Full Technical Program, Previews
- Semiconductor Plant Rebooted Three Months Faster After The Japanese Earthquake
- Flash Summit 2011: New Insights Into the Future of NAND Flash, Top 10 Lists Trends
- Flash Memory Summit 2011: Fusion-io, STEC, and Other Presentations
- Intel 22nm 3D Tri-Gate FinFETs Transistors: Faster, Cooler, Smaller
- Semiconductor News: Japan Earthquake Impact Electronic Supply Chain
- ISSCC 2011 Highlights- 20-nm Process Challenges, Samsung 512-pins DRAM, Intel SandyBridge, AMD Bulldozer
- Samsung develops superfast mobile DRAM
- NAND Flash Evolution 2006 to 2010
- Semiconductor News: TI, Qualcomm, Samsung Tablet processors
- Future technologies that may succeed flash memory
- Upcoming 2011 International Solid State Circuits Conference (ISSCC)
- 2010 International Technology Roadmap for Semiconductors (ITRS) Updates
- 2010 IEDM Update
- iPhone/ Android Smart Phone Repeating Mac/ PC Market Patterns?
- 2010 IEDM Full Technical Program, Previews
- Semiconductor IC Ranking 2009 (Samsung, Hynix growing, SanDisk surprise)
- Integrating High-k Metal Gate: First or Last
- ISSCC 2010 - Intel, Renesas, Toshiba show mobile media chips, Inductive coupling packs flash drive, Chip links hit 20 Gbits/s, power lows
- Four Billion Cell Users : Computing Power Anytime, Anyplace
- Google Nexus One Carries $174.15 Materials Cost, iSuppli Teardown Reveals
- IEDM 2009 -Will IBM Shift to Gate-Last; Intel 32 nm PMOS; Silicon CMOS for 22 nm; Logic Processes
- How much of a lead does Intel have at 32nm and for High-K Metal Gate (HKMG) Technologies?
- Semiconductor Industry Trends in Light of 2008 Economic Upheaval
- Semiconductor IC Ranking Q3 2009 (fast growth at Samsung, Toshiba, Hynix, Micron)
- Intel Developer Forum 2009: Performance, Reliability, and Future Direction of Solid State Drive (SSD)
- Flash Memory Summit 2009: Fusion-io, STEC, Denali and Other Presentations
- Semiconductor Inventory and its Impact on Electronic Supply Chains- iSupply
- Semiconductor IC Ranking Q2 2009(Climbing TSMC, Hynix, MediaTek Droping AMD, Freescale, Fujitsu)
- Intel’s New SSD X25 Reviews and Benchmarks
- Apple iPhone 3GS Teardown (Reverse Engineering) of Chip Components and Software Capabilities
- SSD Market Share and Sales with Breakdown by Density
- Palm Pre Teardown
- Q&A: Analogic CEO
- Semiconductor Companies Q1 2009 Market Shares
- DRAM and NAND Q1 2009 Market Shares
- Is Mobile Computing the Next Big Market?
- SandForce Brings MLC to Solid State Drives (SSD)
- Long Term Trends in the NOR and NAND Markets
- Fusion-io Super Fast NAND Flash Storage Using PCIe for Enterprise Market
- Faster Cheaper Solid-State Hard Drive
- ISSCC 2009
- ISSCC 2009 Preview
- 15 Technology Challenges for 22-nm Node
- DRAM Ranking for Second and Third Quarters
- China's Semiconductor Industry
- Semiconductor Industry Rankings for First Three Quarters of 2008
- SanDisk's ExtremeFFS - New Flash Management System for Improving SSD Performance and Reliability
- Samsung Buying Sandisk? (Update)
- Samsung Buying Sandisk?
- Status of Semiconductor's Intellectual-Property (IP)
- Fab Cost is Increasing The Number of Joint Ventures and Joint Developments
- Learning Curve Leads to Shakeout in SSD Market
- NAND for mobile handsets: cost, density and performance advantages
- 2008 Semiconductor Industry Rankings - IC Insights
- Intel Developments- Mobile Phone and TV Processor
- Netbook (or Low Cost) PC Market
- Intel's SSD Drives
- Samsung Electronics and Sun Microsystems Increased 5x Endurance of Solid State Drives (SSD) with 8 Gbit Single-Level-Cell (SLC)
Additional Semiconductor News
- Non-Volatile Memory Host Controller Interface (NVMHCI)
- Demand for NAND Flash Memory for Handsets Doubles its Share of Market, Making up the Biggest Share of NAND Market
- Update - Apple’s iPhone 3G Semiconductor Parts
- Solid-State-Based Lighting Could Cut the Energy Used by Lighting in Half, Says the U.S. Department of Energy (DOE)
- Leave Laptop at Home and Travel with USB Key Drive Instead
- VLSI 2008 Symposium Highlights
- VLSI 2008 Circuits Program
- Trends in the Wi-Fi industry - Michael Hurlson of Broadcom
- Trends in storage, the economy and network - LSI CEO Abhi Talwalkar
- Seagate Technology, the World's Largest Maker of Hard Disk Drives (HDDs) Sues STEC, a Small Solid-State Drives (SSD) Maker
- Faster SSD Appearing in the Market (estimate 200MB/sec)
- iPod Touch Components likely to be in Future of the iPod line - iSuppli Tear Down
- Evolution of Components in Smart Phones
- Taiwan IC Designers Venture into New LED Applications
- Flash Memory and SSD Reliability - Comments by Intel and Samsung
- MTRON 32GB SSD vs. Seagate and Samsung 's SSD
- 2008 Semiconductor Industry Growth and 2007 Rankings and Revenues - iSuppli
- ISSCC 2008 Highlights
- Intel, Micron New ONFi 2.0 Interface Boost the Data Transfer Rate of NAND Flash-Memory 5x
- Reverse Engineering of iPhone Video
- Comparing iPhone, Blackberry, Sony Ericsson, and Motorola
- Counterfeit Part's Impacts on the Semiconductor Industry
- Memory Chip Architecture Development - Harnessing Multiple Cores for Parallel Execution
- IC Semiconductor's 2008 Growth Forecasts for PCs, Memories, and Phones from Industry Strategy Symposium (ISS)
- Chip Makers Must Shift from Fabs to Systems - Infineon CEO
- Samsung, Toshiba Share OneNAND and LBA-NAND Flash Specs to Improve Supply Availability
- Intel and STMicroelectronics Shipping Functional Prototype of Phase-Change Memory (PCM)
- Rambus Demonstrates Terabyte Memories Using Fast Channels
- IEDM Technical Program - 2007
- A Very Low-Power Analog-to-Digital (A/D) Converter Technology
- LED Developments for Alternating Current (AC) LEDs in LCD Backlights and for Lighting Traffic Lights, and Emergency Exit Signs.
- Toshiba's Logical Block Addressing (LBA) Interface for NAND Flash Reportedly has Received Support from Samsung Against ONFI
- iPhone Semiconductor Components
- Comments About the Push to Reduce the Specifications for ESD in Digital ICs
- NVMHCI Standard for NAND Flash Module Controllers in Notebooks, Desktops, and Servers
- PC's Crashes Due to Single-bit DRAM Errors and Can be Solved Using ECC- According to Microsoft
- DDR3 New Product Validation, Shipments by Qimonda, Micron, Samsung, and Elpida
- Key Developments in Intel's Quad-core, Penryn, Silverthorne & Mobile Processors
- Leading Chip Makers Push to Reduce the Specifications for ESD in Digital ICs
- Mosaid Claims New Flash Interface Offers 10x Boost
- Hynix Received Validation on its DDR3 Memory Components and Modules from Intel
- Qimonda and Micron Technology Delivered Samples of Next-Generation DDR3 DRAM Ahead of Samsung Electronics
- PCM and FRAM Products Introduction
- Hynix Introduces 512Mb Mobile DDR with ECC Support
- U.S. Consumer Electronic Spending Slowed in 2006 to Half the Growth Rate in 2005
- ISSCC News - Substantially Faster DRAM using SOI for Embedded Applications
- Renesas and Matsushita Develop Circuits to Stabilize SRAM Operation in Embedded Control Applications on 45nm Technology
- SanDisk Introduces 32GB SSD 1.8-inch Solid State Drive (SSD) as a Drop-in Replacement for the Standard Mechanical Hard Disk Drive
- Open NAND Flash Interface (ONFI) Group Introduced a Chip-level Interface Standard for NAND Flash Memory
- Automotive Electronics Future Trends for Micro, Memory, Logic ICs; Analog, Mixed Signal and Discrete Devices